Union Electronics and Information Technology Minister Ashwini Vaishnaw on 6 November launched the web application portal for the second phase of the Semicon India programme, ‘Semicon 2.0’. Along with this, approval was announced for 12 new applications under the Electronics Components Manufacturing Scheme (ECMS). These projects are estimated to involve a total investment of ₹7,503 crore. According to the government, they are expected to generate production worth ₹39,045 crore and create 7,127 direct employment opportunities.
Applications opened for three key areas
Through the Semicon 2.0 portal, applications have been opened for three of the programme’s six strategic areas. These include manufacturing semiconductor machines and materials, setting up new chip fabrication units (fabs), and strengthening the chip assembly, testing and packaging industry. The central government has made a financial provision of ₹1,27,500 crore for this programme. Under it, the focus will be on chip design, machinery, materials, manufacturing units, research and development, and the development of skilled talent.
Projects to be set up in seven states
The 12 projects approved under ECMS will be set up in Gujarat, Karnataka, Madhya Pradesh, Maharashtra, Punjab, Tamil Nadu and Uttar Pradesh. These include products related to multilayer printed circuit boards, relays, heat sinks, special ceramics, copper foil, battery materials, polypropylene film, camera rims and industrial equipment.
After these new approvals, the number of applications sanctioned under ECMS has risen to 118. All these projects together are estimated to involve a total investment of ₹77,051 crore and potential production of more than ₹5.73 lakh crore. They are expected to create about 81,755 direct employment opportunities.
India’s capacity in semiconductor sector growing
According to the government, in the first phase of the Semicon India programme, 12 projects were approved in six states, with proposed investment of more than ₹1.64 lakh crore. Of these, five projects had started commercial production by October 2026. The aim of the new phase is to strengthen domestic supply chains for chip manufacturing and electronic components in the country and reduce dependence on imports.
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