SRM University-AP, Technosmile Sign Educational Exchange Pact
CNN Central News & Network–ITDC India Epress/ITDC News Bhopal: SRM University-AP has officially signed a milestone Memorandum of Understanding (MoU) with Technosmile, a premier global hiring and human resources firm based in Japan, to establish a robust international student internship programme. The signed agreement establishes a direct pathway for students to secure technical training, language proficiency, and international employment opportunities in Japan. The MoU execution took place at the university campus, with Dr Vinayak Kalluri, Registrar, SRM AP, and Watanabe, Executive Vice President of Technosmile, signing the document. During the visit, the Technosmile delegation also held extensive strategic discussions with Prof. C V Tomy, Professor and Dean of the School of Engineering & Sciences (SEAS), alongside the Registrar, and Dr M S Vivekanandan, Director of CR&CS, to outline the academic integration of the programme. The event gathered key university dignitaries, department heads, and students to celebrate the international alliance.
This strategic partnership builds upon a successful existing relationship, which has already seen 5 talented students graduated from the institution successfully placed into competitive roles through the company. Formalising this collaboration, the program is set to scale up significantly. Technosmile aims to recruit 8 students in the academic year of 2026, followed by 10 students for internship to placement in 2027. In the next 4 years, Technosmile is considering to hire a total of 50 students. These international internships are structured to directly lead to full-time career conversions upon graduation. By formalising this collaboration, both organisations aim to create a sustainable pipeline of skilled young professionals ready to transition from academic learning to global corporate environments.
The timely agreement directly addresses one of Japan’s most critical economic challenges, namely its rapidly declining working-age population. As the country faces severe labour shortages across key industrial and technological sectors, international talent integration has become a vital solution for maintaining economic momentum and innovation. Through this MoU, Technosmile will actively bridge the gap by sourcing, training, and integrating ambitious students from the institution into the Japanese workforce, offering them invaluable global exposure while simultaneously injecting fresh perspectives into the local industry.
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